Process Integration Engineer, Advanced Packaging (1st Shift) (Palm Bay, FL)

Company: L3Harris Technologies
Location: Melbourne
Posted on: October 16, 2024

Job Description:

Job Title: Process Integration Engineer, Advanced Packaging (1st Shift) (Palm Bay, FL)

Job Code: 16915

Job Location: Palm Bay, FL



Job Description:

L3Harris Technologies is seeking a highly motivated Advanced Packaging Process Integration Engineer to join the Microelectronics Division at Palm Bay, FL location. As a member of our dynamic and collaborative environment, you will be responsible for developing and integrating semiconductor processes to support the production of advanced electronic systems from pilot-line to full-scale production. We are looking for a candidate who is passionate about their work, thrives in a fast-paced environment, and has a strong background in semiconductor process integration for advanced packaging applications. If you are ready to take on new challenges and contribute to the success of our company, we would love to hear from you.



Essential Functions:

Serve as the manufacturing authority for process integration in 2.5D/3D integrated device systems for advanced packaging efforts.
Validate device layout files with Design Engineers with a Design-for-Manufacturing and Design-for-Test mindset.
Partner with Design and Yield Engineering teams to develop Process Control Monitors (PCM) and electronic test structure strategies.
Partner with Yield Engineering to develop yield improvement and process margins improvement roadmaps to ensure manufacturing ramps of new technologies can be met.
Create, document, and transfer integrated process flows for new microelectronic device systems.
Create detailed process documentation, standard operating procedures, and execute appropriate change management where necessary.
Collaborate with cross-functional teams of both internal and external partners to identify and drive process improvements.
Troubleshoot and resolve process issues using structured problem-solving methods to ensure high-quality, cost-effective production.
Prepare detailed reports and presentations for management, project stakeholders, and customers highlighting project progress and other relevant findings.
Continuously evaluate and optimize processes to improve efficiency, enhance product quality, and meet cost targets.
Ensure compliance with all safety and quality standards.
Stay organized and meet project deadlines in a fast-paced environment.
Keep current with industry trends and advancements in advanced packaging process technologies.
Collaborate with internal stakeholders to develop and implement strategic plans for new business development opportunities from a manufacturing point-of-view.
Coach and mentor junior engineers on process development and integration.
Maintain a positive attitude and contribute to a collaborative and inclusive work environment.
Represent the company and its values in a professional and ethical manner.
Maintain a safe and organized work environment.



Qualifications:

Bachelor's Degree and minimum 9 years of prior relevant experience; or Graduate Degree and a minimum of 7 years of prior related experience.
Degree concentration in Electrical, Mechanical, Computer Engineering, Chemistry, Physics, Materials, or related field
5+ years' experience within the semiconductor industry focused on advanced packaging
Ability to obtain a Top Secret Clearance
Ability to travel domestically and/or internationally 25% or more
Subject matter expert with comprehensive knowledge in advanced packaging
In-depth knowledge of project management
Previous experience in one or more of the following semiconductor process areas: lithography, wet etch, dry etch, deposition, planarization, metrology, etc.

Preferred Additional Skills:

10+ years' experience in the advanced packaging industry
Hold an Active Top Secret Clearance
Experience working in classified government programs
Extensive expertise in using statistical software and tools for data analysis, such as JMP, Minitab, or Python
Flexibility with job responsibilities and pro-active with assuming additional responsibilities related to scope
Strong collaboration skills focused on positive team dynamics and the ability to communicate effectively across multi-functional teams
Ability to effectively prioritize multiple sophisticated and complex tasks
Tenacity to work effectively under tight timelines and limited resources
Ability to work with minimal direction with a strong sense of responsibility, ownership, and follow-through
Employ a growth mindset and seek opportunities to work multi-functionally, network, and gain competency across domains.

Keywords: L3Harris Technologies, Boynton Beach , Process Integration Engineer, Advanced Packaging (1st Shift) (Palm Bay, FL), Engineering , Melbourne, Florida