Technologist, 3D Semiconductor Integration and Advanced Packaging Engineer
Company: L3Harris Technologies
Location: Palm Bay
Posted on: October 16, 2024
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Job Description:
Job Title: -Technologist, 3D Semiconductor Integration and
Advanced Packaging EngineerJob Code: 16213Job Location: - Palm Bay,
FLJob Schedule: 9/80 (Every other Friday off!)Relocation:
Relocation assistance is available to qualified applicants -Job
Description: -Responsible for architecting 3D semiconductor
packaging solutions and heterogeneous integration processes. - Work
across the industry to identify partners, tools, and technologies
to develop advanced packaging solutions for 3D-ICs, 2.5D, chiplets,
silicon interposers, and other applications utilizing high density
interconnect such as wafer-to-wafer and die-to-wafer stacking. -
This key role will provide technical insight for our existing
technologies and develop new technologies to capture and lead new
programs with our military, government, and commercial
customers.---Come join out great team! -Essential Functions: -
Keywords: L3Harris Technologies, Boynton Beach , Technologist, 3D Semiconductor Integration and Advanced Packaging Engineer, Engineering , Palm Bay, Florida
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here to apply!
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